Heat Resistant Fire Proof Tempered Borosilicate Pyrex Glass Plates

• Customization: Available
• After-sales Service: None
• Warranty: None
• Type: Acousto-Optic Glass
• Structure: Solid
• Moh′s Hardness: 7
• Shape: Plate
• Function: Optical Function
• Transparency: Transparent
• Processing Method: Ultrapurification
• Preparation Process: Fusion Method
• Color: Clear
• Usage: 3D Printer Raw Material

Product Description

Product Description

Heat resistant fire proof tempered borosilicate pyrex glass plates

Materials: Borosilicate glass
Size: 150*150*3mm
200*200*3mm
Customizad also avaliable.
Usage: 3D printer as printer screen

Low-expansion Borosilicate (LEGB) Windows are very useful as windows in many harsh applications because borosilicate glass has excellent chemical and thermal-shock resistance and has a maximum working temperature of 500° C so are excellent for use in high powered light source applications or an excellent choice for cold and hot mirror substrates.
Borosilicate windows can also be a good substrate for optical flats as it has low expansion properties and therefore maintains its flatness in different environmental conditions.
High temperature load capacity:
- up to 550° C permanent load
- up to 600° C temporarily (< 10h)
Low thermal coefficient of expansion
Thermal coefficient matches silicon
(anodic bonding)
High thermal shock resistance
Clear, practically colorless appearance
Low fluorescence
High UV-Transmission
High chemical resistance against acids,
Bases and organic substances
Low alkali content in the glass composition
Low specific weight

BOROSILICATE FLOAT GLASS 3.3 application
Substrates for dielectric coatings
Lighting applications
Optical filter coating substrates
Wafer substrates
Anodic bonding applications
Biotechnology
Photovoltaics
Environmental technology
Harsh environments
Neutron absorbers
Measurement and sensor technology
Any enquires, please feel free to contact me; )

Mechanical   properties
Density (g/cm3) (at 25°C)	2.23±0.02
Knoop hardness	480
Flexure   strength	24Mpa
Thermodynamic   properties
Coefficient   of   thermal   expansion (α) (0-300°C)	3.3±0.1×10-6
Softening point (°C)	830±10
Strain   point  (°C)	521±10
Specific   heat   capacity	(2-100°C)0.83KJ×(kg×K)-1
Thermal conductivity	1.2W×(m×k)-1
Thermal shock resistance(K)	300
Temperature performance(K)	200
Maximum   working   temperature	(>10h, 600°C), (>10h, 550°C)
Chemical properties
Water   resistence	ISO719/DIN12111, HGB1 ISO720, HGA1
Acid   resistance	ISO1776/DIN12116, 1
Alkali   resistance	ISO695/DIN52322, A2
Optical   properties
Refractive   index	Nd: 1.47379
Transmittance (5mm)	>92%
Electrical   properties
Specific   resistance  1g	250°C, 8.0Ω×cm
Dielectric loss	Tan , 38×(10)-4
Dielectric Constant	4.7
Chemical   component
SiO2	79-82%
B2O3	8-14%
Na2O	2-4%
Al2O3	1-6%